24 Rolls per Order, Made to Order
Pads available in 1.0 mm
Soft for good conformability even to non-flat integrated circuit (IC) surfaces and heat spreading blocks
Little to no siloxane gas/oil bleeding that can cause electric connection failures
High pressure relaxation helps reduce pressure to electric components
Good electrical insulation properties
Slight tack allows easy pre-assembly
Good wetting performance for better thermal conductivity
3M™ Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path between heat generating components like integrated circuit chips and heat spreaders like aluminum heat sinks.
3M™ Thermally Conductive Acrylic Interface Pad 5570N consists of a highly conformable, slightly tacky acrylic elastomer sheet filled with thermally conductive ceramic particles.