MG Chemicals 8329TCM-200mL Thermal Adhesive, High TC.

Features

This heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

• Thermal conductivity of 1.4 W/(m·K)
• 1:1 mix ratio
• Working time: 45 minutes
• Cure time: 24 hours room temperature or 1 hour at 65 °C (149 °F)
• Made In Canada.