Mg Chemicals 8329TCM-6ML Medium Cure Thermal Conductive Adhesive

Features

The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. Used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.