Made to Order, 1 Kit (2 Pails per Kit) per Order
This is designed to be a high quality solution. It is formulated with undiluted Bis F resin, so it has superior physical properties to conventional diluted Bis A systems. Cured with a polyamide, it is not as brittle as the more common amine cured thermally conductive systems, and can be machined to shape.
832TC is a 2-part, black, thermally conductive epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies.
This product is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
This thermal potting epoxy has a convenient 1:1 volume mix ratio, making it compatible with most dispensing equipment. 832TC can be cured at room temperature or higher.
Breakdown Voltage: 48 300 V
Dielectric Strength: 386 V/mil
Hardness: 81 D
Tensile Strength: 23 N/mm2
Compressive Strength: 87 N/mm2
(stainless steel): 13 N/mm2
(aluminum): 16 N/mm2
Glass Transition Temperature (T): 50 ˚C
CTE Prior Tg: 142 ppm/˚C
CTE After Tg: 114 ppm/˚C
Thermal Conductivity @ 25 ˚C: 0.7 W/(m·K)
Service Temperature Range: -30 –175 ˚C
Intermittent Temperature: 200 ˚C