120 Rolls pe Order, Made to Order
Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.