3M Polyester Delaminating Tape 3305, 50 mm x 100 m PL(20) EXP

Features

120 Rolls pe Order, Made to Order

Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding

Transparency allows for inspection without tape removal

High instant adhesion to substrate

Good holding power

3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.