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3M Wafer De-Taping Tape 3305, 25 mm x 100 m
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3M Wafer De-Taping Tape 3305, 25 mm x 100 m

by 3M
$1,100.99 - $1,100.99
$1,100.99
$1,100.99 - $1,100.99
$1,100.99
Free shipping
Extended Handling May Be Required
40 Rolls per Order, Made to OrderEnables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debondingTransparency allows for inspection without tape removalHigh instant adhesion to substrateGood holding power3M™... Read more

Overview

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3M Wafer De-Taping Tape 3305, 25 mm x 100 m

  • 3M
  • 7010321285

40 Rolls per Order, Made to Order

Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding

Transparency allows for inspection without tape removal

High instant adhesion to substrate

Good holding power

3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

Product Details

General Information
Manufacturer
3M
Part Number
7010321285
Product Type
Tape Adhesive & Fasteners`
California Residents
Proposition 65 Warning