Silicone-Free Heat Sink Compound draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is...
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Overview
Techspray 1978-DP Heat Sink Compound, Silicone Free, White Paste
- CPU Fans & Heatsinks
- Techspray
- 1978-DP
Features
Silicone-Free Heat Sink Compound draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.Product Details
General Information
Manufacturer
Techspray
Part Number
1978-DP
Product Type
Heat Sink Compound
Physical Characteristics
Miscellaneous
Packaging
Retail
Country of Origin
United States