Velleman VTBB2N Solderless Breadboard - 830 Holes

Features

Features

• base socket (see figure): twin columns of 5 x 64 terminals are separated by a 0.3" center channel
• bus strip (see figure): 4 buses of 25 connected terminals are arranged in 4 rows

Specifications

• voltage: max. 30 V
• current: max. 3 A
• material:
  • external body: external body is made of ABS
  • clips: the internal interconnected clips are made of an alloy of silver and nickel
• base socket: 1
• bus strip: 2
• tie points: 830
• 14-pins IC capacity: 9
• binding post: 0
• dimensions: 6.6" x 2.2" x 0.4"
• weight: 3.4oz